Semiconductor News & Analysis Feed
318 articles
2026-07-04
www.ad-hoc-news.de
2026-07-04
Ad-hoc-news.de
2026-07-04
theindependent.sg
2026-07-04
The Independent Singapore News
2026-07-04
digitimes.com
2026-07-04
Machvision posted another record monthly revenue in June 2026, as surging demand for AI servers, high-performance computing (HPC), and advanced packaging continued to lift orders for the semiconductor and PCB inspection equipment maker. The company said the biggest challenge has now shifted from winning orders to managing supply chains and expanding capacity.
2026-07-04
www.klsescreener.com
2026-07-04
KLSE Screener
2026-07-04
www.thestar.com.my
2026-07-04
The Star
2026-07-03
www.thelec.net
2026-07-03
thelec.net
Samsung Electronics logo. (Source: Samsung Electronics)
Samsung Electronics is reportedly in discussions with North American artificial intelligence (AI) company Anthropic to manufacture its custom AI chips through Samsung's foundry business. The chips are expected to use Samsung's leading-edge 2-nanometer (2nm) process technology.
According to The Information, citing multiple sources on July 2
2026-07-03
digitimes.com
2026-07-03
TSMC has accelerated efforts to localize its supply chain in recent years, using joint development, joint validation, and long-term partnerships to help Taiwanese equipment, materials, and chemical suppliers enter the advanced semiconductor supply chain. The move is steadily building a more resilient and complete local supply system, with both CoWoS and panel-level advanced packaging (CoPoS) now s
2026-07-03
digitimes.com
2026-07-03
As transistor density scaling slows, chipmakers are leaning on advanced packaging to keep improving accelerator performance. A SemiAnalysis roundup of this year's IEEE Electronic Components and Technology Conference described a shift in which Intel, Marvell, TSMC, and others detailed new packaging approaches as packages themselves begin hitting limits.
2026-07-03
digitimes.com
2026-07-03
SK Hynix plans to invest KRW100 trillion (approx. US$64.38 billion) to build new NAND memory chip and advanced packaging facilities in Cheongju, betting that AI demand will keep tightening supply for storage and server memory.
2026-07-02
www.indexbox.io
2026-07-02
IndexBox
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2026-07-02
www.investing.com
2026-07-02
Investing.com
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2026-07-02
www.marketscreener.com
2026-07-02
marketscreener.com
2026-07-02
ca.investing.com
2026-07-02
Investing.com Canada
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2026-07-02
www.prnewswire.com
2026-07-02
PR Newswire
Nova WMC™ Expanding Adoption Across the Most Advanced Packaging Processes
NEWS PROVIDED BY
Nova
02 Jul, 2026, 14:30 IDT
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REHOVOT, Israel, July 2, 2026 /PRNewswire/ -- Nova (NASDAQ: NVMI), today announced the selection of its Nova WMC™ platform by a leading global foundry customer for multiple layers' measurement in the most advanced packaging processes. The selection fol
2026-07-02
www.prnewswire.com
2026-07-02
PR Newswire
Nova WMC™ Expanding Adoption Across the Most Advanced Packaging Processes
NEWS PROVIDED BY
Nova
Jul 02, 2026, 07:30 ET
SHARE THIS ARTICLE
REHOVOT, Israel, July 2, 2026 /PRNewswire/ -- Nova (NASDAQ: NVMI), today announced the selection of its Nova WMC™ platform by a leading global foundry customer for multiple layers' measurement in the most advanced packaging processes. The selection fol
2026-07-02
www.linkedin.com
2026-07-02
LinkedIn
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Everyone's talking about AI chips. But what makes those chips powerful in the first place?
‘Without advanced packaging, there is no AI,’ says Audrey Charles, SVP, Advanced Packaging & President, Lam Capital.
In this episode of Voices From The Valley, Audrey expla
2026-07-01
www.trendforce.com
2026-07-01
TrendForce
[News] ASE Reportedly Raises Advanced Packaging Quotes by More Than 20% in Latest AI-Driven Price Hike
2026-07-01 Semiconductors editor
News
Please note that this article cites information from MoneyDJ, Liberty Times, and Economic Daily News.
AI-driven semiconductor demand is reportedly fueling another round of price increases across the OSAT industry. According to MoneyDJ, citing indust
2026-07-01
finance.biggo.com
2026-07-01
finance.biggo.com
TSMC's (2330.TW) advanced packaging technology roadmap is undergoing a major shift. Market sources indicate the company plans to gradually transition from current silicon interposers to its "CoPoS" large-size glass interposer technology around 2029. This move is viewed as the most critical strategic decision in the advanced packaging arena for the next decade and is expected to exert significant p
2026-07-01
digitimes.com
2026-07-01
South Korea's government laid out a detailed plan on June 30 for building its southwest region into a major new semiconductor production base, with SK, Samsung Electronics and Amkor outlining a combined KRW896 trillion (approx. US$581 billion) in investment covering memory chip fabs, AI data centers and advanced packaging.
2026-06-30
www.thelec.net
2026-06-30
thelec.net
Applied Materials’ enhanced Centura Prime Epi system (Photo=Applied Materials)
Applied Materials has introduced six new semiconductor manufacturing systems for DRAM and advanced packaging, expanding its portfolio of 3D semiconductor equipment aimed at improving the performance and power efficiency of next-generation memory used in artificial intelligence (AI) processors.
The company unveiled