SemiPulse — Semiconductor Intelligence

AI and Advanced Packaging Drive Global Semiconductor Materials Revenue to a Record $73.2 Billion in 2025 - Bisinfotech

0.9

www.bisinfotech.com 2026-05-13 Bisinfotech

__empty__

Ableprint posts record first-quarter profit as CPO orders set to begin in June

0.75

digitimes.com 2026-05-13

Ableprint reported record first-quarter 2026 revenue and profit as customers installed and qualified new advanced packaging production lines and expanded shipments of high-end process equipment, with the company saying demand tied to co-packaged optics started to convert into orders. The firm posted net profit after tax of NT$415 million, up 82.1% year on year, and first-quarter revenue rose 81.9%

Taiwan's semiconductor supply chain posts broadly positive April; AI demand clearly visible across ecosystem

0.95

digitimes.com 2026-05-13

Of the 238 Taiwan-listed semiconductor and related companies tracked by Digitimes,73% (173 companies)posted positive year-on-year revenue growth in April 2026, and58% (139)grew month-over-month. Memory makers, AI server assemblers, and advanced packaging houses led the advance, while silicon wafer suppliers and a handful of fabless names faced ongoing headwinds.

ASYS Q1 Deep Dive: AI Demand and Advanced Packaging Drive Revenue Growth and Guidance Upside - Yahoo! Finance Canada

0.9

ca.finance.yahoo.com 2026-05-12 Yahoo! Finance Canada

__fail__

Semiconductor Metrology/Inspection Is Capturing the Economics of Advanced Packaging - Dr. Robert Castellano's Semiconductor Deep Dive Newsletter

0.93

drrobertcastellano.substack.com 2026-05-12 Dr. Robert Castellano's Semiconductor Deep Dive Newsletter

__fail__

Taiwan AI testing boom lifts KYEC, MPI, and WinWay to record 2026 revenue

0.92

digitimes.com 2026-05-12

Taiwan's semiconductor testing and probe card supply chain maintained solid momentum entering 2026, driven by continued AI accelerator, high-performance computing (HPC), and advanced packaging demand.

TSMC's US and Japan expansion lifts Trusval

0.92

digitimes.com 2026-05-12

Taiwan-based semiconductor facility engineering firm Trusval reported strong results for the first quarter of 2026, supported by continued growth in global AI computing demand, TSMC's accelerated expansion of 2nm process and advanced packaging capacity, and ongoing fab construction projects across the semiconductor, high-tech, and memory industries.

TSMC CoWoS shortage drives SK Hynix-Intel 2.5D push

0.92

digitimes.com 2026-05-12

TSMC's tight CoWoS supply is reportedly pushing SK Hynix to work with Intel on advanced packaging, as the industry looks to diversify the 2.5D packaging supply chain for AI accelerators.

Quantum Computing Advanced Packaging Market Accelerates Growth with Forecast to $241.8M by 2033 - SRI - openPR.com

0.75

www.openpr.com 2026-05-11 openPR.com

__fail__

Malaysia eyes 7 percent global advanced packaging share by 2035 - TNGlobal

0.8

technode.global 2026-05-11 TNGlobal

__fail__

ASE, Wus to jointly build Kaohsiung advanced packaging plant by 2029 - digitimes

0.92

www.digitimes.com 2026-05-11 digitimes

Advanced Semiconductor Engineering (ASE) and PCB manufacturer Wus Printed Circuit are teaming up to build a new packaging facility in southern Taiwan, as the world's largest chip assembler moves to expand capacity ahead of surging AI-driven demand. The plant,...The article requires paid subscription.Subscribe Now

Semiconductor Packaging Advanced Packaging Taiwan Semiconductor Industry AI Chip Demand Wafer Fab Expansion Semiconductor Equipment Investment Supply Chain Integration Chip Manufacturing

ASE, Wus to jointly build Kaohsiung advanced packaging plant by 2029

0.92

digitimes.com 2026-05-11

Advanced Semiconductor Engineering (ASE) and PCB manufacturer Wus Printed Circuit are teaming up to build a new packaging facility in southern Taiwan, as the world's largest chip assembler moves to expand capacity ahead of surging AI-driven demand. The plant, to be located in the Kaohsiung Nanzih Technology Industrial Park, is scheduled to open in September 2029.

TrendForce Sees Tightening Advanced Packaging and 3nm Capacity as AI Competition Turns Into a Supply Chain Arms Race - EE Times Asia

0.88

news.google.com 2026-05-11 EE Times Asia

__fail__

SÜSS MicroTec SE stock: Semiconductor equipment maker eyes growth in advanced packaging and lithogr - AD HOC NEWS

0.9

www.ad-hoc-news.de 2026-05-09 AD HOC NEWS

__fail__

Can KLA's Advanced Packaging Strength Support $1B Revenue Target? - The Globe and Mail

0.7

www.theglobeandmail.com 2026-05-08 The Globe and Mail

__fail__