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2026-06-16
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2026-06-16
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GLOBAL, NEW YORK GENERAL BUSINESS, INTERNET / TECHNOLOGY
SEEQC Joins U.S. CHIPS Act–Backed Effort to Advance Scalable Quantum Chip Manufacturing
JUNE 16, 2026
SEEQC has joined a federally supported initiative aimed at accelerating the development of scalable quantum chip manufacturing in the United States, contributing technology and expertise to a multi-year progr
2026-06-16
pokde.net
2026-06-16
Pokde.Net
Pokde.Net > System > Software > AI > Cadence ChipStack AI Super Agent Achieves Full Autonomy For Chip Development
AI
NEWS
SOFTWARE
SYSTEM
Cadence ChipStack AI Super Agent Achieves Full Autonomy For Chip Development
Last updated: June 16, 2026 9:23 pm
By
Low Boon Shen
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2 Min Read
Earlier in COMPUTEX 2026, Cadence announced the extension of its ChipStack AI Super Agent to Level-5 autonomy, des
2026-06-16
ca.investing.com
2026-06-16
Investing.com Canada
ca.investing.com
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2026-06-16
seekingalpha.com
2026-06-16
Seeking Alpha
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2026-06-16
thequantuminsider.com
2026-06-16
The Quantum Insider
PRESS RELEASE — SEEQC, Inc. (“SEEQC” or the “Company”), a developer and manufacturer of scalable, energy efficient digital chips for quantum computing systems, today announced its participation in a four-year Microelectronics Commons Northeast Regional Defense Technology Hub (NORDTECH) program.
As one of eight U.S. Microelectronics Commons hubs, NORDTECH collaborates with regional partners across
2026-06-16
tomshardware.com
2026-06-16
Andrew E. Freedman
Microsoft is updating the Surface Pro and Surface Laptop using the latest Qualcomm Snapdragon X2 chips, along with haptic feedback on the Laptop's touchpad and a new jade color.
2026-06-16
memeburn.com
2026-06-16
Memeburn
TL;DR
Google is reportedly in talks with Samsung to help manufacture its future AI chip, codenamed Icefish.
TSMC will likely remain the primary producer, but capacity constraints are pushing Google to diversify suppliers.
The move highlights how the AI boom is reshaping the global semiconductor industry and supply chains.
Google could soon give Samsung a major role in building one of its most ad
2026-06-16
wccftech.com
2026-06-16
Wccftech
Memory makers are now adopting domestically produced larger size DDR5 memory chips for their DDR5 modules.
Instead of depending on the three memory giants, such as Samsung, Micron, and SK Hynix, some memory vendors in China are now adopting domestically produced DDR5 chips. As per IT Home, two vendors known as Gloway and KingBank have introduced their latest DDR5 memory modules, using the 24 Gb m
2026-06-16
news.google.com
2026-06-16
Business Wire
2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
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SEEQC Awarded Participation in U.S. CHIPS Act–Backed Microelectronics Commons NORDTECH Quantum R&D Program
Business Wire
Tue, June 16, 2026 at 5:05 AM PDT 2 min read
Company Contributes to 300mm Wafer-Scale Superconducting Qubit Manufacturing and Workforce Development
ELMSFORD, N.Y., June 16, 2026--(
2026-06-16
www.globsec.org
2026-06-16
GLOBSEC
www.globsec.org
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2026-06-16
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2026-06-16
Anton Shilov
CoPoS may enable larger chips, but CoWoS is still better.
2026-06-16
letsdatascience.com
2026-06-16
Let's Data Science
INFRASTRUCTURE
tsmc
chip packaging
cowos
copos
TSMC highlights CoWoS strength over panel packaging for largest AI chips
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June 16, 2026
6.8
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Photo: cdn.mos.cms.futurecdn.net · rights & takedowns
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At TSMC's European Technology Symposium, Kevin Zhang, TSMC's senior vice president of business development and global sales and deputy co-COO, said that panel-l
2026-06-16
www.prnewswire.com
2026-06-16
PR Newswire
Valens Semiconductor's HDBaseT Chipsets Power Barco's ClickShare USB-C Extension Over CAT Kit
NEWS PROVIDED BY
Valens Semiconductor
Jun 16, 2026, 06:30 ET
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HOD HASHARON, Israel, June 16, 2026 /PRNewswire/ -- Valens Semiconductor (NYSE: VLN) today announced that its HDBaseT chipsets will form the connectivity infrastructure inside of Barco's ClickShare USB-C Extension ov
2026-06-16
www.prnewswire.com
2026-06-16
PR Newswire
Valens Semiconductor's HDBaseT Chipsets Power Barco's ClickShare USB-C Extension Over CAT Kit
NEWS PROVIDED BY
Valens Semiconductor
16 Jun, 2026, 13:30 IDT
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HOD HASHARON, Israel, June 16, 2026 /PRNewswire/ -- Valens Semiconductor (NYSE: VLN) today announced that its HDBaseT chipsets will form the connectivity infrastructure inside of Barco's ClickShare USB-C Extension ov
2026-06-16
www.morningstar.com
2026-06-16
Morningstar
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Valens Semiconductor's HDBaseT Chipsets Power Barco's ClickShare USB-C Extension Over CAT Kit
Valens Semiconductor's HDBaseT Chipsets Power Barco's ClickShare USB-C Extension Over CAT Kit
Provided by PR Newswire Jun 16, 2026, 6:30:00 PM
Valens Semiconductor's HDBaseT Chipsets Power Barco's ClickShare USB-C Extension Over CAT Kit
Valens Semiconductor's HDBaseT Chipsets Power
2026-06-16
www.milanofinanza.it
2026-06-16
Milano Finanza
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2026-06-16
Benzinga
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
ASE Tech, TW0003711008
New high-density fan-out module, ASE Technology pushes advanced packaging for AI chips
16.06.2026 - 03:43:12 | ad-hoc-news.de
ASE Technology is highlighting its FOCoS fan-out module as a high-density packaging option for AI and data center processors, combining multiple dies and high-bandwidth memory in a single advanced substrate stack for hyperscale and HPC customers.
AS
2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
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Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor Manufacturing
PR Newswire
Mon, June 15, 2026 at 6:00 PM PDT 3 min read
New collaboration provides framework between the Japan government and Italy
TOKYO, June 15, 2026 /PRNewswire/ -- Rapidus Corporation today announced that