Semiconductor News & Analysis Feed
865 articles
2026-06-16
www.foreignpolicyjournal.com
2026-06-16
foreignpolicyjournal.com
Qualcomm (NASDAQ: QCOM) is reportedly in advanced talks to acquire AI chip startup Tenstorrent in a deal valued between $8 billion and $10 billion, according to Reuters.
The potential acquisition would mark a significant strategic expansion for Qualcomm, pushing the chipmaker beyond its traditional mobile processor and connectivity chip stronghold.
Trump plans massive July 4 celebration, ICE age
2026-06-16
www.openpr.com
2026-06-16
openPR.com
Consent to Cookies & Data processing
We use cookies in accordance with our privacy policy linked below to process end device information and personal data. This serves the integration of content, external services and elements of third parties, statistical analysis/measurement, personalized advertising as well as the integration of social media. Depending on the function, data is thereby passed on
2026-06-16
newsroom.equinix.com
2026-06-16
Equinix Newsroom
Presidio deploys Cisco Secure AI Factory with NVIDIA at Equinix data center in complementary, partner-led lab environment
Endorsed architectures and live testing lab deliver faster path for enterprises from pilot to production AI
REDWOOD CITY, Calif., June 16, 2026 /PRNewswire/ -- Equinix, Inc. (Nasdaq: EQIX), the world's digital infrastructure company®, today unveiled an expanded collaboration
2026-06-16
news.google.com
2026-06-16
Business Wire
2026-06-16
news.google.com
2026-06-16
Business Wire
2026-06-16
tomshardware.com
2026-06-16
Anton Shilov
Next-generation data center processors from AMD and Intel with 16 DDR5 memory channels are even bigger than today’s designs.
2026-06-16
letsdatascience.com
2026-06-16
Let's Data Science
INFRASTRUCTURE
tsmc
chip packaging
cowos
copos
TSMC highlights CoWoS strength over panel packaging for largest AI chips
1 sources
|
June 16, 2026
6.8
Relevance Score
Photo: cdn.mos.cms.futurecdn.net · rights & takedowns
QUICK SUMMARY
Hide
At TSMC's European Technology Symposium, Kevin Zhang, TSMC's senior vice president of business development and global sales and deputy co-COO, said that panel-l
2026-06-16
tomshardware.com
2026-06-16
Hassam Nasir
Intel's cancelled "Arctic Sound" AI GPU based on the original Xe-HP architecture has been pictured sporting two tiles and 32GB of HBM2E.
2026-06-16
tomshardware.com
2026-06-16
Bruno Ferreira
Oracle's Project Jupiter is targeting a New Mexico desert already struggling with water consumption, but the company assures residents that the data center's water usage is "negligible."
2026-06-16
www.tradingkey.com
2026-06-16
TradingKey
TSMC is collaborating with Ibiden and Innolux to validate glass substrates for its new CoPoS advanced packaging technology. This shift from wafer-level to panel-level processing aims to overcome limitations of traditional organic and silicon interposers. Simulation results indicate glass substrates offer significant improvements in warpage, thermal expansion, elastic modulus, power integrity, and
2026-06-16
www.channelnewsasia.com
2026-06-16
CNA
Singapore
PUB channels S$12 million to develop water efficiency solutions for wafer fabrication, data centres: DPM Gan
The data centre and chipmaking industries are water-intensive and provide critical components and services for artificial intelligence.
A file photo of an employee walking through a data centre. (Photo: REUTERS/Priyanshu Singh)
Listen
5 min
New: You can now listen to articles.
2026-06-16
ourworldindata.org
2026-06-16
Our World in Data
Spending on the hardware that trains and runs artificial intelligence has grown rapidly over the past years. One of the clearest indicators of how rapidly spending has increased is the revenue of American chipmaker NVIDIA.
The company accounts for around 85% of the global market for AI chips. These are graphics processing units (GPUs), originally built for video games but well-suited to the paral
2026-06-16
digitimes.com
2026-06-16
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC substrate suppliers,Unimicron,Kinsus, andNanya PCB, to restart capacity expansion targeting GPU, CPU, and ASIC customers.
2026-06-16
digitimes.com
2026-06-16
AMD said it will acquire MEXT, a move aimed at strengthening its AI and data center portfolio amid rising global memory demand. The deal is intended to help customers improve performance, reduce infrastructure costs, and accelerate the deployment of AI, analytics, and high-performance workloads across cloud and enterprise systems.
2026-06-16
simplywall.st
2026-06-16
simplywall.st
United States/Semiconductors/NasdaqGS:POWI
Does Power Integrations’ (POWI) Kyber-Optimized GaN Push Redefine Its High-Voltage AI Data Center Ambitions?
June 16, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
Share
Copy Link
In June 2026, Power Integrations introduced two ultra-slim auxiliary power supply reference designs for 800 VDC AI data centers, including a 15 W single-output and a 35 W six-
2026-06-16
eetimes.com
2026-06-16
GlobalFoundries leads with the first silicon to support OCI MSA, shaking up AI data centers.
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
China, GaN
China GaN Ban Tests Infineon's AI Data Center Momentum as Forward P/ E Hits 34x
15.06.2026 - 21:05:17 | boerse-global.de
Infineon accelerates €5B Dresden fab to 2026, but patent dispute in China forces halt of GaN sales. AI power chip revenue forecast to grow, stock up 111% YTD.
China - China GaN Ban Tests Infineon's AI Data Center Momentum as Forward P/E Hits 34x 15.06.2026 - Bild: ü
2026-06-16
tomshardware.com
2026-06-16
Anton Shilov
AMD acquires MEXT to get Predictive Memory Engine that offloads infrequently accessed data from DRAM to NAND storage.
2026-06-16
letsdatascience.com
2026-06-16
Let's Data Science
FUNDING & BUSINESS
micron
hbm
market analysis
semiconductors
Micron's Sold-Out HBM Capacity Creates June 24 Catalyst
1 sources
|
June 15, 2026
5.5
Relevance Score
Photo: i-invdn-com.investing.com · rights & takedowns
QUICK SUMMARY
Hide
A Market Analysis highlights that Micron Technology Inc has sold out its HBM capacity and identifies June 24 as a make-or-break catalyst. The analysis also covers
2026-06-16
tomshardware.com
2026-06-16
Jowi Morales
Local governments demand more time to study how they can manage the impacts of huge data center projects.