Semiconductor News & Analysis Feed
310 articles
2026-06-28
news.futunn.com
2026-06-28
富途牛牛
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2026-06-27
simplywall.st
2026-06-27
simplywall.st
United States/Semiconductors/NasdaqGS:KLIC
Kulicke And Soffa Industries (KLIC) Following Advanced Packaging Demand Is The Rally Already Priced In
June 27, 2026
Simply Wall St
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Advanced packaging demand puts Kulicke and Soffa Industries (KLIC) in focus
Kulicke and Soffa Industries (KLIC) is drawing fresh investor attention as strong demand for its Thermo Compression Bo
2026-06-27
www.digitimes.com
2026-06-27
digitimes
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply...
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2026-06-27
news.futunn.com
2026-06-27
富途牛牛
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2026-06-27
digitimes.com
2026-06-27
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers, ETNewsand Yonhapreported.
2026-06-27
digitimes.com
2026-06-27
China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic substitution are driving a new capacity cycle.
2026-06-27
digitimes.com
2026-06-27
ShunSin, a Foxconn-affiliated packaging and testing company, held its 2026 annual general meeting, with chairman Shang-Yi Chiang presiding. Chiang said ShunSin will leverage its packaging, testing, and optoelectronic integration capabilities under Foxconn's "3+3+3" strategy to seize advanced packaging opportunities in AI optical communications.
2026-06-27
www.asiae.co.kr
2026-06-27
아시아경제
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2026-06-27
www.msn.com
2026-06-27
MSN
Applied Materials (AMAT) held a master class event this week, and much of the focus was on the company's positioning in dynamic random access memory and advanced packaging, Wall Street analysts said.
“In our view, these insights reflect broader tech trends reshaping the entire semi supply chain,” Susquehanna analyst Mehdi Hosseini wrote in a note to clients. “The rising complexity of next-gen DRA
2026-06-26
seekingalpha.com
2026-06-26
Seeking Alpha
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2026-06-25
www.manilatimes.net
2026-06-25
The Manila Times
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips
A new epitaxy system optimized for DRAM fabs adds a critical logic-class step-boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints
New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
www.marketscreener.com
2026-06-25
marketscreener.com
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2026-06-25
finance.yahoo.com
2026-06-25
Yahoo Finance
This is a paid press release. Contact the press release distributor directly with any inquiries.
Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips
Applied Materials, Inc.
Thu, June 25, 2026 at 6:00 AM PDT 6 min read
AMAT
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Applied Materials, Inc.
Innovations spanning DRAM and advanced packaging enable the
2026-06-25
www.globenewswire.com
2026-06-25
GlobeNewswire
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips
A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints
New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
www.igorslab.de
2026-06-25
igor´sLAB
LATEST NEWS
ASE is building 15 new sites: Advanced Packaging is becoming the next major AI bottleneck
25. June 2026 06:00Samir Bashir
📖 Reading time: approx. 9 minutes · 1,647 words · 10,736 characters
In the case of AI chips, people like to talk about transistors, HBM bandwidth, and compute performance. Eventually, however, the GPU, memory, chiplets, and power supply must actually be assembled i
2026-06-25
digitimes.com
2026-06-25
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing close market attention to how the rivalry with ASE and Amkor will reshape market share. ASE Chief Operating Officer Tien Wu said he is "optimistic," stating that strong demand from US customers and the need to divers
2026-06-25
digitimes.com
2026-06-25
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening capacity for AI computing, high-performance chips, high-density memory and automotive electronics.
2026-06-25
www.indexbox.io
2026-06-25
IndexBox
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2026-06-24
simplywall.st
2026-06-24
simplywall.st
United States/Semiconductors/NasdaqGS:INTC
Can Intel’s New Foundry Chief Reframe INTC’s Role in Advanced Packaging and AI Supply Chains?
June 24, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
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Earlier this month, Intel appointed former SK hynix and SK On chief Seok-Hee Lee as executive vice president of Intel Foundry, putting him in charge of advanced packaging, system integration
2026-06-24
www.insidermonkey.com
2026-06-24
Insider Monkey
NEWS
Intel (INTC) Advanced Packaging Could Support AI Data Center Growth, Mizuho Says
Published on June 24, 2026 at 9:47 am by GHAZAL AHMED in News
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Intel (NASDAQ:INTC) is one of the 15 AI Stocks Analysts Are Watching: Microsoft, Nvidia, and More.
Intel Corporation may benefit from tailwinds coming from advanced packaging technologies, which has led one firm to raise estimates and its price