BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the evening of May 20 that it had signed a three-year memorandum of understanding with US glass materials supplier Corning to cooperate in glass-based packaging substrates, foldable glass, perovskite glass substrates and optical interconnects.

China's OSAT providers are trying to move deeper into advanced packaging as artificial intelligence (AI) demand strains global chip packaging supply, creating an opening for companies that have long played a lower-profile role in the semiconductor value chain.

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Nan Ya PCB, one of Taiwan's leading IC substrate manufacturers, said it expects capital spending to rebound sharply in 2026, potentially reaching a record high, as demand from advanced chip packaging customers accelerates alongside the rapid growth of artificial intelligence (AI) computing.

AI server demand is pushing semiconductor packaging into a new growth cycle, but the market remains heavily concentrated among a small group of global outsourced semiconductor assembly and test leaders and Taiwanese and Chinese companies, sharpening the challenge for South Korea's back-end chip industry.

AP Memory reported that net profit for the first quarter of 2026 rose 91% to NT$660 million (US$20.93 million) as the company scaled mass production of its S-SiCap silicon capacitor and benefited from strong demand for its IoTRAM customized memory. The Taiwan-based chip packaging and memory supplier said silicon capacitor shipments entered a ramp-up phase in the first quarter of 2026 as AI and hig

South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging (FO-PLP) equipment for advanced chip packaging in the second half of 2026, with the systems expected to be used in the mass production of networking chips for SpaceX.

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To secure a foothold in the booming market for advanced AI chip packaging and testing, Taiwan's outsourced semiconductor assembly and test (OSAT) industry is entering what executives and analysts describe as an unprecedented expansion cycle. Industry observers estimate that combined capital expenditures by Taiwanese OSAT providers could surge to a record NT$400 billion (approx. US$12.7 billion) in

Intel is relocating a data center chip production line from Costa Rica to its Vietnam facility. The move, flagged in a Saigon Hi-Tech Park management board report to the Ho Chi Minh City People's Committee and cited byThe Investorand VN Economy,...The article requires paid subscription.Subscribe Now

KR JP Industry Finance Real Estate IT Retail Science Policy Society International Entertainment Culture Sports English IT Applied Materials buys ASMPT's NEXX to boost panel-level chip packaging By  Jeong Du-yong Published 2026.05.07. 10:08 /Courtesy of Applied Materials Semiconductor equipment corporations Applied Materials said on the 7th that it signed a definitive agreement with ASMPT to acqui

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