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2026-05-28
www.tomshardware.com
2026-05-28
Tom's Hardware
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Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management
News
By Luke James published 20 minutes ago
China now has a prototype tool designed for vertical circuit stacking.
(Image credit: Getty Images)
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2026-05-28
tomshardware.com
2026-05-28
Luke James
The announcement came two days after Huawei presented LogicFolding and its accompanying Tau Scaling Law at ISCAS 2026.
2026-05-28
www.digitimes.com
2026-05-28
digitimes
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
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2026-05-28
www.digitimes.com
2026-05-28
digitimes
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the
2026-05-28
digitimes.com
2026-05-28
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
2026-05-27
www.barrons.com
2026-05-27
Barron's
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2026-05-27
www.investing.com
2026-05-27
Investing.com
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2026-05-27
digitimes.com
2026-05-27
Printed circuit board (PCB) drill bit manufacturer Topoint Technology approved a private placement of unsecured convertible corporate bonds with a maximum issuance amount of NT$600 million (approx. US$19.10 million) at its shareholders' meeting on May 26. The company also welcomed Unimicron Technology, Gold Circuit Electronics (GCE), and Zhen Ding Technology Group (ZDT) as strategic investors.
2026-05-27
digitimes.com
2026-05-27
SmartSens and Unisoc have formed a strategic partnership to develop Micro LED high-speed optical interconnects, aiming to deliver domestic, low-power, high-bandwidth solutions for short-reach AI cluster links. The collaboration could accelerate the commercialization of Micro LED co-packaged optics (CPO) technology and strengthen China's role in global AI infrastructure supply chains, according to
2026-05-26
qz.com
2026-05-26
qz.com
EMERGING TECHNOLOGIES
Huawei is unveiling a new 3D chip design it says can close the gap with global leaders
The Chinese tech giant says its new stacked-chip architecture can deliver transistor density equivalent to 1.4nm processes by 2031, without access to advanced lithography tools
By
Cris Tolomia
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Published 16 minutes ago
2026-05-26
www.actuia.com
2026-05-26
Actu IA
Artificial intelligence/Huawei Announces LogicFolding: 3D Density Without EUV Machines, Targeting 1.4 nm by 2031
Table of contents
A Temporal Scaling Law to Succeed Moore
LogicFolding: 3D Against EUV, and Its Shades
A 3D Architecture That Isn't Uniquely Huawei's
He Tingbo, the Tutelary Figure of HiSilicon
On May 25, 2026, He Tingbo, president of Huawei's semiconductor department and board member
2026-05-26
news.financial
2026-05-26
news.financial
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2026-05-26
www.tradingview.com
2026-05-26
TradingView
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2026-05-26
www.prnewswire.com
2026-05-26
PR Newswire
AIC to Showcase Next-Generation AI Infrastructure and Host Strategic Panel with NVIDIA and VAST Data at COMPUTEX 2026 Deutschland - English
VOM NACHRICHTENDIENST
AIC
26 Mai, 2026, 02:18 GMT
ARTIKEL TEILEN
TAIPEI, May 26, 2026 /PRNewswire/ -- AIC, a leading provider of AI storage and computing solutions, is proud to announce its participation in COMPUTEX 2026. From June 2 to June 5, AIC
2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-26
digitimes.com
2026-05-26
As Micron Technology's decision to restart large-scale DDR4 production in the US grabs global attention, memory-chip executives and analysts say the move is less a revival of aging technology than a strategic reshuffling of supply aimed at safeguarding critical American industries.
2026-05-25
tomshardware.com
2026-05-25
Etiido Uko
Flagship Huawei Mate 90 series will be the first commercial processors to feature the LogicFolding architecture
2026-05-25
www.tomshardware.com
2026-05-25
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law
News
By Etiido Uko published 11 hours ago
Flagship Huawei Mate 90 series will be the first commercial processo
2026-05-24
www.ad-hoc-news.de
2026-05-24
AD HOC NEWS
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2026-05-24
m.ajupress.com
2026-05-24
aju press
RelatedASIA DEEP INSIGHT: The truth and illusion of Samsung Electronics' strike and tasks ahead