Semiconductor News & Analysis Feed
547 articles
2026-06-30
www.thelec.net
2026-06-30
thelec.net
Applied Materials’ enhanced Centura Prime Epi system (Photo=Applied Materials)
Applied Materials has introduced six new semiconductor manufacturing systems for DRAM and advanced packaging, expanding its portfolio of 3D semiconductor equipment aimed at improving the performance and power efficiency of next-generation memory used in artificial intelligence (AI) processors.
The company unveiled
2026-06-30
www.digitimes.com
2026-06-30
digitimes
As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating its push into 2nm-and-below nodes as well as advanced packaging technologies such as CoWoS. Industry sources said the AI-driven...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each tim
2026-06-30
www.digitimes.com
2026-06-30
digitimes
As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals giant DuPont and separately listed — is likewise expanding its production capacity investment in Taiwan. Asia-Pacific president...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they
2026-06-30
www.digitimes.com
2026-06-30
digitimes
As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals giant DuPont and separately listed — is likewise expanding its production capacity investment in Taiwan. Asia-Pacific president...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they
2026-06-30
biz.chosun.com
2026-06-30
Chosunbiz
By
Jeong Du-yong
Published 2026.06.30. 15:27
Image of HANMI Semiconductor's 2.5D TC Bonder 40 equipment./Courtesy of HANMI Semiconductor
HANMI Semiconductor said on the 30th it will launch a new tool, "2.5D TC Bonder 40," which supports the 2.5-dimensional (D) packaging process for AI semiconductors. The company plans to supply equipment to global foundries and outsourced semiconductor assembly
2026-06-30
www.mk.co.kr
2026-06-30
매일경제
www.mk.co.kr
Performing security verification
This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot.
Ray ID: a1772f229c5d388c
Performance and Security by Cloudflare
Privacy
2026-06-30
digitimes.com
2026-06-30
AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs, tightening capacity across both 8-inch mature processes and 12-inch advanced nodes. CoWoS's advanced packaging and HBM capacity are also set for a prolonged supply shortage, effectively rewriting the foundry industry's business cycle.
2026-06-30
digitimes.com
2026-06-30
As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating its push into 2nm-and-below nodes as well as advanced packaging technologies such as CoWoS. Industry sources said the AI-driven investment wave is now spreading beyond foundries into the equipment, materials, factory engineering, and inspection supply chains.
2026-06-30
digitimes.com
2026-06-30
TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to use a new "round-to-square" architecture to break through cost and capacity bottlenecks in large AI chip packaging and build its next competitive moat.
2026-06-30
digitimes.com
2026-06-30
Qnity, the independent company spun off from US chemicals giant DuPont, is ramping up investment in Taiwan as the island cements its role at the center of the global AI hardware supply chain. Asia-Pacific president Dennis Chen said in an interview with DIGITIMESthat future spending will focus on three main battlegrounds: advanced packaging, co-packaged optics (CPOs), and thermal management.
2026-06-30
www.tradingview.com
2026-06-30
TradingView
News
/
Zacks
/
ASE Technology vs. Amkor: Which Chip Packaging Stock Is the Better Buy?
ASE Technology vs. Amkor: Which Chip Packaging Stock Is the Better Buy?
5 min read
3711
−4.12%
AMKR
+0.33%
Artificial intelligence (AI) and high-performance computing are driving unprecedented demand for advanced semiconductor packaging, making outsourced semiconductor assembly and test (OSAT) providers increas
2026-06-29
logisticsbusiness.com
2026-06-29
Logistics Business
More than 160 attendees representing 87 companies across 30 countries gathered at the headquarters of CMC Packaging Automation for CID26 – CMC Innovation Day 2026, the company’s annual event dedicated to innovation in fulfilment automation, systems integration and right-sized packaging.
Built around the theme ‘Ecosystem’, CID26 brought together customers, technology partners, policymakers and ind
2026-06-29
www.kedglobal.com
2026-06-29
KED Global
S.Korea unveils $590 bn chip investment plan for new fabs, packaging
SK Hynix's Icheon Campus in Gyeonggi Province (Courtesy of SK Hynix) South Korea on Monday unveiled a 911 trillion won ($591 billion) semiconductor investment plan spanning new memory fabs in the southwest, an advanced packaging cluster in the Chungcheong region and a supply chain hub in the so
2026-06-29
www.snsinsider.com
2026-06-29
SNS Insider
The Power Module Packaging market is showing significant growth due to an increase in the usage of electric vehicles, implementation of renewable energy, AI-based data centers, and industrial electrification. Power module packaging technology plays an essential part in improving thermal management, reliability, energy density, and energy efficiency of today's power electronics systems. Adoption of
2026-06-29
www.insidermonkey.com
2026-06-29
Insider Monkey
NEWS
Wall Street Firm Says Intel (INTC) Has a Cost Edge Over TSMC in the Advanced Chip Packaging Race
Published on June 29, 2026 at 6:18 am by ABDUL RAHMAN in News
SHARE
Intel Corporation (NASDAQ:INTC) is one of the best fast growth stocks to buy according to hedge funds. On June 26, Goldman Sachs initiated coverage of the stock with a Neutral rating and $150 price target. The firm anticipates fa
2026-06-29
finance.yahoo.com
2026-06-29
Yahoo Finance
Wall Street Firm Says Intel (INTC) Has a Cost Edge Over TSMC in the Advanced Chip Packaging Race
Abdul Rahman
June 29, 2026 2 min read
INTC
+1.54%
2330.TW
-0.81%
Trade Intel on Coinbase
Trading disclosure
Intel Corporation (NASDAQ:INTC) is one of the best fast growth stocks to buy according to hedge funds. On June 26, Goldman Sachs initiated coverage of the stock with a Neutral rating and $150 pr
2026-06-29
www.digitaltoday.co.kr
2026-06-29
디지털투데이
Industry
Applied Materials expands packaging equipment lineup to boost HBM, chiplet yields
AI Summary
Applied Materials unveiled six new semiconductor manufacturing tools spanning advanced packaging and DRAM processes, the company said on Sunday. It said AI computing faces a “memory wall” as bandwidth and capacity lag growing model sizes and data throughput, driving demand for high-bandwidth memo
2026-06-29
biz.chosun.com
2026-06-29
Chosunbiz
By
Jeong Du-yong
Published 2026.06.29. 10:01
The lineup of 3D chip manufacturing equipment for AI semiconductors unveiled by Applied Materials./Courtesy of Applied Materials
Semiconductor equipment corporations Applied Materials unveiled a lineup of 3D chip manufacturing tools for artificial intelligence (AI) semiconductors. The focus is on expanding planarization, deposition and metrology tools
2026-06-29
digitimes.com
2026-06-29
Global revenue for the semiconductor industry's "Foundry 2.0" market reached US$86 billion in the first quarter of 2026, up 23% year-over-year, driven by strong demand for AI accelerators and advanced packaging, according to Counterpoint Research.
2026-06-29
digitimes.com
2026-06-29
Kyocera is committing JPY650 billion (approx. US$4 billion) to its components businesses through fiscal 2031, as AI data center investment and semiconductor equipment spending lift demand for ceramic parts, optical communication packages, and advanced semiconductor packaging materials.