Semiconductor News & Analysis Feed
351 articles
2026-05-29
www.moomoo.com
2026-05-29
Moomoo
To create a seamless experience and for website quality and improvement purposes, we use cookie technologies for verification and quality purposes, to personalize the content presented, and to provide advertising that may be of specific interest to you. Learn our Privacy Policy here.
May 29th - The industry of $Power semiconductor (LIST24211.HK)$ is trending lower today with 1 constituents up, 7
2026-05-29
www.automotiveworld.com
2026-05-29
Automotive World
Infineon has introduced a 1300 V SiC power module operating at 205°C, 30 degrees above the industry standard, for EV inverter use
May 29, 2026
Infineon Technologies has introduced a 1300 V silicon carbide (SiC) power module for electric vehicle (EV) inverters, the first within its HybridPACK Drive family capable of continuous operation at 205°C, a 30°C increase over the 175°C industry standard.
2026-05-29
simplywall.st
2026-05-29
simplywall.st
__fail__
2026-05-29
digitimes.com
2026-05-29
Unimicron said it will push advanced substrate and AI system-board upgrades in 2026 to capture accelerating demand for AI-related ASICs and switches, aiming for record revenue that would exceed its 2022 peak. The IC substrate and printed circuit board maker announced the strategy at its annual shareholders' meeting at the end of May, citing a shift in demand away from GPUs and CPUs toward ASICs, s
2026-05-29
digitimes.com
2026-05-29
Arm EVP and Chief Commercial Officer Will Abbey visited QBit Semiconductor's Taiwan headquarters on May 27, signaling deeper cooperation that could shape future chip design for edge AI, physical AI, and quantum-computing cybersecurity. The visit highlights how platform alliances are increasingly influencing next-generation computing architectures for global technology markets.
2026-05-29
digitimes.com
2026-05-29
Nvidia CEO Jensen Huang gave a media interview after the "trillion-dollar dinner" in Taipei, Taiwan, on May 28, commenting on topics including competition in the artificial intelligence (AI) industry, cloud service providers (CSP) developing in-house application-specific integrated circuits (ASIC), Huawei's technological progress, Taiwan's role as a center of the AI revolution, and energy demand.
2026-05-29
digitimes.com
2026-05-29
Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply tighten worldwide. For readers across global tech markets, the shift means access to manufacturing capacity, not just chip design, is becoming the main determinant of who can supply the next wave of AI hardware.
2026-05-29
digitimes.com
2026-05-29
As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At a recent system-semiconductor seminar in South Korea, Seong-jun Jang, a research center director at the Korea Electronics Technology Institute (KETI), outlined four key architectural directions for future AI chips aimed
2026-05-29
www.marketscreener.com
2026-05-29
marketscreener.com
Access Denied
You don't have permission to access "http://www.marketscreener.com/news/cadence-and-samsung-foundry-deepen-2nm-and-3da-ic-collaboration-to-meet-surging-ai-infrastructure-a-ce7f5ddadf8dfe21" on this server.
Reference #18.85813217.1779989089.4a6df450
https://errors.edgesuite.net/18.85813217.1779989089.4a6df450
2026-05-28
bioengineer.org
2026-05-28
Bioengineer.org
In the face of a rapidly evolving electronic landscape, the challenge of electromagnetic interference and pollution has surged to the forefront of scientific research and technological innovation. High-intensity, multi-frequency electromagnetic radiation poses pervasive risks that extend beyond the mere disruption of electronic devices, threatening information security and biological health across
2026-05-28
www.eenewseurope.com
2026-05-28
eeNews Europe
Toshiba has started test-sample shipments of a 1200V trench-gate SiC MOSFET aimed at power supply systems in AI data centres. The TW007D120E is housed in a QDPAK top-side cooled package and is designed to support higher current capability, improved thermal performance and higher power density in the power stage.
2026-05-28
www.eurekalert.org
2026-05-28
EurekAlert!
__fail__
2026-05-28
247wallst.com
2026-05-28
24/7 Wall St.
__fail__
2026-05-28
chargedevs.com
2026-05-28
Charged EVs
chargedevs.com
Performing security verification
This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot.
Ray ID: a029b72fe901d6cb
Performance and Security by Cloudflare
Privacy
2026-05-28
digitimes.com
2026-05-28
Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive systems, drones, and industrial automation, ETNewsreported, citing industry sources.
2026-05-28
digitimes.com
2026-05-28
Qualcomm has reportedly landed more than one ASIC customer, with a separate project for a US cloud service provider also taking shape, according to industry sources. The development follows reports from Bloombergand other media that ByteDance, the developer of TikTok, is Qualcomm's first major client for its custom chip push.
2026-05-28
www.manufacturing.net
2026-05-28
Manufacturing.net
www.manufacturing.net
Performing security verification
This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot.
Ray ID: a0281e8c5aec5936
Performance and Security by Cloudflare
Privacy
2026-05-28
news.google.com
2026-05-28
EDN - Voice of the Engineer
2026-05-27
www.theregister.com
2026-05-27
The Register
AI+ML
Broadcom's custom ASIC biz adds South Korea's FuriosaAI to its empire
Third-gen chips to use Broadzilla's advanced packaging, networking tech
Tobias Mann
Systems editor
0
Published Wed 27 May 2026 // 13:00 UTC
Broadcom has added FuriosaAI to its list of partners building AI accelerators atop its chip packaging tech.
After years quietly serving as the connective tissue behind many modern
2026-05-27
tomshardware.com
2026-05-27
Mark Tyson
A deep tech startup has come out of stealth brandishing a prototype of what it claims to be 'the world’s first fluid circuit board.'