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2026-06-16
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Key Points
Elon Musk's SpaceX went public at an initial market value of $1.8 trillion, making it the largest IPO in history.
Among the 15 largest U.S. IPOs on record, the average stock dropped 33% during its first year on the market.
SpaceX trades at 115 times sales, which is 95% more expensive than the most richly valued stock in the S&P 500.
10 stocks we like better than Space Exploration Te
2026-06-16
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2026-06-16
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WASHINGTON, June 16 (Reuters) - U.S. President Donald Trump has invoked the Defense Production Act to address constraints in weapons supply and development for munitions production and supply chains, according to a memo made public on Tuesday.
The move comes amid growing concern in Washington about the capacity of U.S. weapons manufacturers to meet demand.
Solid rocket motors, igniters and guida
2026-06-16
tomshardware.com
2026-06-16
Anton Shilov
CoPoS may enable larger chips, but CoWoS is still better.
2026-06-16
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2026-06-16
Tom's Hardware
Tech Industry Manufacturing Semiconductors
TSMC says panel packaging won't replace CoWoS anytime soon for the largest future AI processors — wafer-level tech can scale to 58 massive dies in one package
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By Anton Shilov published 16 hours ago
CoPoS may enable larger chips, but CoWoS is still better.
(Image credit: Intel)
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2026-06-16
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2026-06-16
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TSMC highlights CoWoS strength over panel packaging for largest AI chips
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June 16, 2026
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At TSMC's European Technology Symposium, Kevin Zhang, TSMC's senior vice president of business development and global sales and deputy co-COO, said that panel-l
2026-06-16
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2026-06-16
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2026-06-16
www.digitimes.com
2026-06-16
digitimes
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and...
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2026-06-16
focustaiwan.tw
2026-06-16
Focus Taiwan
Taipei, June 16 (CNA) Liao Cheng-wei (廖承威), director general of Taiwan's Intellectual Property Office (TIPO), said on Tuesday that he suspected two firms currently suing contract chipmaker Taiwan Semiconductor Manufacturing Co. (TSMC) for patent infringement are so-called "patent trolls."
When asked whether TIPO has knowledge of the details of the case filed with the U.S. International Trade Comm
2026-06-16
www.insidermonkey.com
2026-06-16
Insider Monkey
NEWS
Taiwan Semiconductor Manufacturing Company Limited (TSM)’s CEO Expresses Concern About Water, Talent Shortages
Published on June 16, 2026 at 2:27 am by ASHAR JAWAD in News
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Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is among the 10 Stocks ChatGPT Predicts Could Make You Wealthy in 3 Years. While speaking at a ceremony for a new science park in Pingtung, the company’s
2026-06-16
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2026-06-16
Yahoo Finance
Taiwan Semiconductor Manufacturing Company Limited (TSM)’s CEO Expresses Concern About Water, Talent Shortages
Ashar Jawad
Mon, June 15, 2026 at 11:27 PM PDT 2 min read
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Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is among the 10 Stocks ChatGPT Predicts Could Make You Wealthy in 3 Years. While speaking at a ceremo
2026-06-16
www.digitimes.com
2026-06-16
digitimes
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS...
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2026-06-16
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2026-06-16
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TSMC is collaborating with Ibiden and Innolux to validate glass substrates for its new CoPoS advanced packaging technology. This shift from wafer-level to panel-level processing aims to overcome limitations of traditional organic and silicon interposers. Simulation results indicate glass substrates offer significant improvements in warpage, thermal expansion, elastic modulus, power integrity, and
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
TSMC, TW0002330008
Capacity push for AI: TSMC’s CoWoS packaging ramps toward 140,000 wafers a month
16.06.2026 - 02:00:19 | ad-hoc-news.de
TSMC’s CoWoS advanced packaging line is emerging as a quiet workhorse of the AI boom. Industry data now points to capacity as high as 120,000 to 140,000 wafers per month by 2026, as the Taiwanese foundry pours billions into a technology that has become critica
2026-06-16
digitimes.com
2026-06-16
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, the partners unveiled a 300mm wafer integration flow that produced both n-type and p-type 2D-material transistors at a 50nm contacted poly
2026-06-16
digitimes.com
2026-06-16
A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has drawn skepticism from Taiwan industry sources, who say the timeline is likely premature and that the company remains focused on evaluating multiple advanced-packaging options.
2026-06-16
digitimes.com
2026-06-16
Samsung Electronics has secured key technology for a 5nm-class magnetoresistive random-access memory cell, according to Korean financial daily Sedaily, moving ahead just four months after presenting what it described as the world's first 8nm-class MRAM at an international conference.
2026-06-16
digitimes.com
2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.
2026-06-16
digitimes.com
2026-06-16
Researchers and chipmakers presented new logic, memory, and device architectures at the 2026 IEEE/JSAP VLSI Technology and Circuits Symposium in Honolulu, with several results pointing toward pilot production and mass manufacturing.
2026-06-16
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2026-06-16
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