Semiconductor News & Analysis Feed
39 articles
2026-07-07
digitimes.com
2026-07-07
Huawei's next-generation flagship Mate 90 smartphone series has reportedly entered the chip packaging and testing stage, according to sources within China's supply chain. The lineup is expected to launch in September 2026 and will be the first to feature Huawei's new Kirin 2026 flagship processor, which is based on the company's Tau Scaling (τ) concept. The device is expected to be one of Huawei's
2026-07-06
digitimes.com
2026-07-06
Asahi Kasei, one of the notable suppliers of Sunfort dry film photoresist in Japan, has initiated a fab expansion project in Taiwan. The newly established plant is expected to further elevate capacity performance in cutting and processing semiconductor packaging substrates.
2026-07-05
news.google.com
2026-07-05
Interesting Engineering
2026-07-04
247wallst.com
2026-07-04
24/7 Wall St.
2026-07-01
digitimes.com
2026-07-01
Cloud AI demand is reshaping the seasonal cycle of the semiconductor industry, with capacity tightness spreading from front-end manufacturing to back-end packaging and testing. Since late 2025, outsourced semiconductor assembly and test, or OSAT, capacity has tightened steadily. New capacity added in 2026 has also been filled quickly, prompting multiple IC design houses to lock in capacity and pus
2026-07-01
simplywall.st
2026-07-01
simplywall.st
2026-06-30
digitimes.com
2026-06-30
TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to use a new "round-to-square" architecture to break through cost and capacity bottlenecks in large AI chip packaging and build its next competitive moat.
2026-06-30
www.tradingview.com
2026-06-30
TradingView
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ASE Technology vs. Amkor: Which Chip Packaging Stock Is the Better Buy?
ASE Technology vs. Amkor: Which Chip Packaging Stock Is the Better Buy?
5 min read
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Artificial intelligence (AI) and high-performance computing are driving unprecedented demand for advanced semiconductor packaging, making outsourced semiconductor assembly and test (OSAT) providers increas
2026-06-29
www.insidermonkey.com
2026-06-29
Insider Monkey
NEWS
Wall Street Firm Says Intel (INTC) Has a Cost Edge Over TSMC in the Advanced Chip Packaging Race
Published on June 29, 2026 at 6:18 am by ABDUL RAHMAN in News
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Intel Corporation (NASDAQ:INTC) is one of the best fast growth stocks to buy according to hedge funds. On June 26, Goldman Sachs initiated coverage of the stock with a Neutral rating and $150 price target. The firm anticipates fa
2026-06-29
finance.yahoo.com
2026-06-29
Yahoo Finance
Wall Street Firm Says Intel (INTC) Has a Cost Edge Over TSMC in the Advanced Chip Packaging Race
Abdul Rahman
June 29, 2026 2 min read
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Intel Corporation (NASDAQ:INTC) is one of the best fast growth stocks to buy according to hedge funds. On June 26, Goldman Sachs initiated coverage of the stock with a Neutral rating and $150 pr
2026-06-26
biz.chosun.com
2026-06-26
Chosunbiz
By
Jeong Du-yong
Published 2026.06.26. 10:39
Product image of the new FC Bonder 3.5 for artificial intelligence (AI) system semiconductors from ##HANMI Semiconductor##./Courtesy of ##HANMI Semiconductor##
HANMI Semiconductor said on the 26th it launched new equipment for artificial intelligence (AI) system semiconductors, the "FC Bonder 3.5" (Flip Chip Bonder 3.5). The company plans to supply th
2026-06-26
digitimes.com
2026-06-26
Corning is studying South Korea as a possible manufacturing base for semiconductor glass substrates, a sign that the US specialty glass and optical materials maker is looking to extend its AI exposure beyond data-center connectivity into advanced chip packaging.
2026-06-25
www.scmp.com
2026-06-25
South China Morning Post
Semiconductors
Tech
China’s JCET to build new plant in Shanghai to expand advanced chip packaging
US$1.15 billion investment underscores advanced packaging’s role in boosting China’s chipmaking capabilities amid rapid AI development
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Xinmei Shen
Published: 8:30am, 25 Jun 2026
Chinese chip-packaging and testing giant Jiangsu Changjiang Electronics
2026-06-25
digitimes.com
2026-06-25
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening capacity for AI computing, high-performance chips, high-density memory and automotive electronics.
2026-06-24
digitimes.com
2026-06-24
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global readers, the shift could shape future device performance, supply chains, and where advanced semiconductors are manufactured and assembled.
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants, according to The Elecand Hankyung, citing industry sources, as the two companies look for ways to add back-end capacity beyond their existing manufacturing hubs.
2026-06-17
digitimes.com
2026-06-17
India-based Kaynes Technology is seeking outsourced automotive semiconductor orders in Japan, a move that could help establish a foothold for Indian backend chip manufacturing in a market long dominated by East Asia. Japanese partners are backing the effort, but the company still faces strict quality hurdles.
2026-06-17
www.sphericalinsights.com
2026-06-17
Spherical Insights
According to market research firm Spherical Insights, which has been working in the semiconductor, advanced packaging, chip manufacturing, artificial intelligence hardware, and electronics supply chain industry for the last 10 years, their market study indicates that the global advanced chip packaging market is experiencing substantial growth and is expected to expand significantly through 2035.
2026-06-16
news.google.com
2026-06-16
Stock Titan
2026-06-15
www.sammobile.com
2026-06-15
SamMobile
SamMobile has affiliate and sponsored partnerships, we may earn a commission.
TSMC remains the undisputed leader in advanced contract chip manufacturing. Samsung has made some strides recently but the gap between the two is quite significant and unlikely to be closed any time soon.
However, there's one area where Samsung enjoys the advantage and the lead, and it appears that TSMC now wants to ta