174 articles
2026-05-14
digitimes.com
2026-05-14
MediaTek's decision to pursue advanced packaging partnerships with both TSMC's CoWoS ecosystem and Intel's EMIB platform has become one of the semiconductor industry's most closely watched strategic moves.
2026-05-14
digitimes.com
2026-05-14
AI server demand is pushing semiconductor packaging into a new growth cycle, but the market remains heavily concentrated among a small group of global outsourced semiconductor assembly and test leaders and Taiwanese and Chinese companies, sharpening the challenge for South Korea's back-end chip industry.
2026-05-14
digitimes.com
2026-05-14
AP Memory reported that net profit for the first quarter of 2026 rose 91% to NT$660 million (US$20.93 million) as the company scaled mass production of its S-SiCap silicon capacitor and benefited from strong demand for its IoTRAM customized memory. The Taiwan-based chip packaging and memory supplier said silicon capacitor shipments entered a ramp-up phase in the first quarter of 2026 as AI and hig
2026-05-14
digitimes.com
2026-05-14
Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates — areas it set aside after more than a year of prioritizing DRAM design and high-bandwidth memory (HBM) competitiveness. The move signals a shift from catch-up mode back toward longer-term technology investment.
2026-05-14
digitimes.com
2026-05-14
TSMC held its annual technology symposium in Hsinchu on May 14, 2026, after its North America stop, with executives noting that AI applications are rapidly expanding from cloud data centers to edge devices — driving surging demand for semiconductor compute density, high-bandwidth connectivity, power efficiency, and thermal management. Ray Wan, director of Asia-Pacific business, said TSMC will leve
2026-05-14
digitimes.com
2026-05-14
TSMC said on May 14, 2026, that it is rapidly expanding CoWoS and SoIC advanced packaging capacity as AI demand drives the construction of 18 new fabs and advanced packaging facilities worldwide. At its 2026 Technology Symposium, TSMC vice president Bor-Zen Tien detailed the company's latest progress in advanced process nodes, 3DFabric advanced packaging, global expansion, and AI-powered smart man
2026-05-14
www.newelectronics.co.uk
2026-05-14
New Electronics
The 3DFabric Alliance forms part of TSMC’s broader ecosystem and is designed to support innovation and adoption of advanced integration techniques. These include a range of 2.5D and 3D packaging technologies such as SoIC, CoWoS, InFO and wafer-level integration platforms. Through participation in the alliance, IC‑Link will gain access to these technologies while contributing its design and manufac
2026-05-13
www.eejournal.com
2026-05-13
EEJournal
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2026-05-13
www.tradingkey.com
2026-05-13
TradingKey
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2026-05-13
www.insidermonkey.com
2026-05-13
Insider Monkey
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2026-05-13
finance.yahoo.com
2026-05-13
Yahoo Finance
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2026-05-13
www.bisinfotech.com
2026-05-13
Bisinfotech
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2026-05-13
digitimes.com
2026-05-13
Ableprint reported record first-quarter 2026 revenue and profit as customers installed and qualified new advanced packaging production lines and expanded shipments of high-end process equipment, with the company saying demand tied to co-packaged optics started to convert into orders. The firm posted net profit after tax of NT$415 million, up 82.1% year on year, and first-quarter revenue rose 81.9%
2026-05-13
digitimes.com
2026-05-13
South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging (FO-PLP) equipment for advanced chip packaging in the second half of 2026, with the systems expected to be used in the mass production of networking chips for SpaceX.
2026-05-13
digitimes.com
2026-05-13
Of the 238 Taiwan-listed semiconductor and related companies tracked by Digitimes,73% (173 companies)posted positive year-on-year revenue growth in April 2026, and58% (139)grew month-over-month. Memory makers, AI server assemblers, and advanced packaging houses led the advance, while silicon wafer suppliers and a handful of fabless names faced ongoing headwinds.
2026-05-13
digitimes.com
2026-05-13
Taiwanese outsourced semiconductor assembly and test (OSAT) services company ChipMOS Technologies reported strong growth in both revenue and profit for the first quarter of 2026. Net profit after tax for the quarter reached NT$505 million (approx. US$16.03 million), up 1% from the previous quarter and 186.37% from a year earlier, while earnings per share (EPS) came to NT$0.72, the highest in the p
2026-05-13
digitimes.com
2026-05-13
Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate the development of multi-die systems, smoothing paths to high-volume manufacturing and benefiting designers across AI, high-performance computing, automotive, and telecommunications markets worldwide—as well as techn
2026-05-12
www.thelec.net
2026-05-12
thelec.net
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2026-05-12
www.trendforce.com
2026-05-12
TrendForce
HomeNews
2026-05-12
ca.finance.yahoo.com
2026-05-12
Yahoo! Finance Canada
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