Semiconductor News & Analysis Feed
22 articles
2026-06-16
www.techpowerup.com
2026-06-16
TechPowerUp
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2026-06-15
bits-chips.com
2026-06-15
Bits&Chips
Headline
ASML, TSMC and Imec scale 2D transistors to 50nm pitch on 300mm wafers
15 June 2026
Paul van Gerven
Editor at Bits&Chips
Reading time: 1 minute
ASML, TSMC and Imec have demonstrated a scalable 300mm manufacturing flow for 2D-material transistors, marking a step toward industrial adoption of post-silicon logic devices. Presented at the 2026 IEEE/JSAP Symposium on VLSI Technology and Circu
2026-06-13
quantumzeitgeist.com
2026-06-13
Quantum Zeitgeist
QUANTUM HARDWARE, DEEP TECH
SiC Transistors Mimic Brain Cells at 10mK for Quantum Control
June 12, 2026
BY IVY DELANEY
Engineers at HKU have demonstrated the first “brain-like” chip capable of mimicking biological neurons at a frigid 10 millikelvin, a crucial step toward solving the wiring challenges that limit quantum computer scalability. The team, led by Professor Yuhao Zhang and PhD student X
2026-06-12
www.techinsights.com
2026-06-12
TechInsights
FinFET Transistors: Tracing the Path of Evolution
Discover how FinFET transistors have revolutionized semiconductor manufacturing with improved performance and efficiency, driving advancements in modern electronic devices.
FinFET transistors, or Fin Field Effect Transistors, have revolutionized advanced semiconductor manufacturing by replacing planar FET transistors, starting with Intel's 22nm t
2026-06-12
www.bisinfotech.com
2026-06-12
Bisinfotech
www.bisinfotech.com
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2026-06-06
www.indexbox.io
2026-06-06
IndexBox
Cristian Spataru
Commercial Manager · XTRATECRO
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Great for Market Insights
2026-06-03
www.eurekalert.org
2026-06-03
EurekAlert!
Power module with 1200-V-class GaN transistors (IMAGE)
FRAUNHOFER INSTITUTE FOR APPLIED SOLID STATE PHYSICS
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Close-up of the power module developed and manufactured at Fraunhofer IAF, featuring 1200-V-class GaN transistors on an insulating substrate for use in bidirectional DC charging systems
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© Fraunhofer IAF
USAGE RE
2026-06-02
eetimes.com
2026-06-02
Kevin Zhang said 3D integration is important, but transistor scaling remains the semiconductor industry's primary driver of performance and energy-efficiency gains.
2026-05-29
wkzo.com
2026-05-29
WKZO
By Eduardo Baptista and Che Pan
BEIJING, May 29 (Reuters) – Huawei’s new chip design principle focused on boosting transmission speed rather than continuing to shrink semiconductors offers a path for China to build cutting-edge chips despite U.S. sanctions, though whether it represents a true breakthrough remains to be seen.
China has been barred since 2019 from importing ASML’s most advanced ex
2026-05-29
wtvbam.com
2026-05-29
WTVB
By Eduardo Baptista and Che Pan
BEIJING, May 29 (Reuters) – Huawei’s new chip design principle focused on boosting transmission speed rather than continuing to shrink semiconductors offers a path for China to build cutting-edge chips despite U.S. sanctions, though whether it represents a true breakthrough remains to be seen.
China has been barred since 2019 from importing ASML’s most advanced ex
2026-05-29
www.reuters.com
2026-05-29
Reuters
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2026-05-28
www.mymalonetelegram.com
2026-05-28
The Malone Telegram
Future Electronics Features Infineon CoolGaN™ Transistors & GaN-Based Solutions for Humanoid Robotics
59 mins ago
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Future Electronics, a global leader in electronic components distribution, is highlighting Infineon Technologies AG CoolGaN™ transistors and GaN-based solutions engineered to support the growing demands of huma
2026-05-26
eetimes.com
2026-05-26
Huawei's answer to Moore's Law without EUV promises 14A performance by 2031.
2026-05-26
digitimes.com
2026-05-26
As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced "Tau (τ) Law" and a related time-scaling theory.
2026-05-25
www.tomshardware.com
2026-05-25
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law
News
By Etiido Uko published 11 hours ago
Flagship Huawei Mate 90 series will be the first commercial processo
2026-05-25
tomshardware.com
2026-05-25
Etiido Uko
Flagship Huawei Mate 90 series will be the first commercial processors to feature the LogicFolding architecture
2026-05-25
www.huaweicentral.com
2026-05-25
Huawei Central
HUAWEI
Huawei Kirin 2026 Chip: 238 MTr/mm2 transistor density rivaling TSMC’s 3nm
Published
4 hours ago
on
May 25, 2026
By
Deng Li
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Huawei has revealed its Kirin 2026 details and it reveals massive upgrade in the chip arachitecture including transistor density.
He Tingbo, Director and President of Semiconductor B
2026-05-25
www.huawei.com
2026-05-25
Huawei
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2026-05-25
digitimes.com
2026-05-25
As the global semiconductor industry confronts the limits of Moore's Law, Huawei has unveiled a new roadmap aimed at extending chip performance growth through architecture, interconnect, and system-level optimisation rather than pure transistor miniaturisation.
2026-05-15
www.openpr.com
2026-05-15
openPR.com
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