Semiconductor News & Analysis Feed
200 articles
2026-06-22
www.digitimes.com
2026-06-22
digitimes
The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in production lines. DIGITIMES has been tracking the latest developments in TSMC's CoPoS...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the
2026-06-22
digitimes.com
2026-06-22
TSMC is accelerating its CoPoS rollout, replacing traditional round wafers with larger rectangular glass panels to support packaging demand for AI GPUs and HPC chips over the next several years. Supply chain sources said the first wave of demo equipment has already been installed at VisEra, a TSMC subsidiary.
2026-06-22
digitimes.com
2026-06-22
The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in production lines. DIGITIMEShas been tracking the latest developments in TSMC's CoPoS advanced packaging technology, with glass core substrates emerging as the most closely watched variable in that story.
2026-06-21
wccftech.com
2026-06-21
Wccftech
TSMC is aggressively working on CoPoS (Panel-Level) packaging to replace CoWoS for growing compute demand as Glass Core Substrates take center stage.
The ever-growing AI and compute demand requires next-generation packaging technologies. Intel and TSMC are aggressively working towards that goal, and glass core substrates are going to be a major part of their trajectories moving forward.
In a rec
2026-06-21
wccftech.com
2026-06-21
Wccftech
TSMC is aggressively working on CoPoS (Panel-Level) packaging to replace CoWoS for growing compute demand as Glass Core Substrates take center stage.
The ever-growing AI and compute demand requires next-generation packaging technologies. Intel and TSMC are aggressively working towards that goal, and glass core substrates are going to be a major part of their trajectories moving forward.
In a rec
2026-06-20
www.ad-hoc-news.de
2026-06-20
AD HOC NEWS
TSMC’s, Booking
TSMC’s Booking Bonanza: Fully Subscribed to 2028 as Clients Eye Samsung and CoWoS Expansion Ramps
20.06.2026 - 16:28:21 | boerse-global.de
TSMC's advanced nodes fully booked by Nvidia, Apple, and others; clients like BYD, AMD, and Google explore Samsung. Stock near €414 record, capital budget at $52-56B for 2026.
TSMC’s - TSMC’s Booking Bonanza: Fully Subscribed to 2028 as Client
2026-06-19
tomshardware.com
2026-06-19
Bruno Ferreira
Tesco UK supermarket chain moves 40,000 servers off of VMWare infrastructure — mass exodus continues thanks to Broadcom's pricing shenanigans
2026-06-18
www.tradingkey.com
2026-06-18
TradingKey
Micron Technology shares rose nearly 5% to approach historical highs on June 18, Eastern Time, driven by sustained demand for AI-linked HBM and high-end DRAM. Following a 253% year-to-date rally, the firm has joined the trillion-dollar market cap club. Major investment banks maintain bullish ratings, with UBS setting a $1,625 target. Investors are now focused on the June 24, Eastern Time, earnings
2026-06-18
digitimes.com
2026-06-18
SK Group's combined market capitalization on the South Korean stock market surpassed KRW2,000 trillion (US$1.32 trillion) for the first time as of the June 16 close, driven by strength in AI memory demand and a high-profile visit by Nvidia's CEO that reinforced ties with SK Hynix and broader AI infrastructure plans. According to reports from SBS, YTN, ET Newsand Yonhap, the group's 19 listed subsi
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants, according to The Elecand Hankyung, citing industry sources, as the two companies look for ways to add back-end capacity beyond their existing manufacturing hubs.
2026-06-18
digitimes.com
2026-06-18
A recent open letter from the UK-based fund Palliser Capital called Taiwanese printed circuit board (PCB) maker WUS Printed Circuit one of the most undervalued AI PCB companies in the capital market. This has once drawn industry attention to the current business cooperation between WUS and its subsidiary in China, WUS Printed Circuit Kunshan.
2026-06-18
digitimes.com
2026-06-18
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square." DIGITIMESbelieves that panel makers have an edge because their existing glass substrates are larger than those used by OSATs, making FOPLP develo
2026-06-18
biz.chosun.com
2026-06-18
Chosunbiz
By
Jeong Du-yong
Published 2026.06.18. 06:02
Glass substrate from Appslix, SKC's semiconductor substrate manufacturing subsidiary./Courtesy of Appslix
TSMC, the world's largest foundry (contract semiconductor manufacturing) corporations, disclosed verification results for the commercialization of glass semiconductor substrates developed in an ecosystem centered on Taiwan and Japan. As a result,
2026-06-17
digitimes.com
2026-06-17
Chinese foundry Nexchip is expanding beyond wafer manufacturing with the establishment of a new wholly owned subsidiary, marking its latest move to deepen its presence across the semiconductor value chain.
2026-06-17
wccftech.com
2026-06-17
Wccftech
The Taiwan Semiconductor Manufacturing Company (TSMC) is expanding its supply chain for glass substrates as part of the first step of establishing a supply chain for the chip-on-panel-on-substrate (CoPoS) packaging technology, according to supply chain sources. The glass substrates will be used in the firm's advanced versions of the chip-on-wafer-on-substrate (CoWoS) packaging technology, and TSMC
2026-06-16
news.google.com
2026-06-16
digitimes
2026-06-16
www.digitimes.com
2026-06-16
digitimes
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time th
2026-06-16
www.digitimes.com
2026-06-16
digitimes
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time t
2026-06-16
www.tradingkey.com
2026-06-16
TradingKey
TSMC is collaborating with Ibiden and Innolux to validate glass substrates for its new CoPoS advanced packaging technology. This shift from wafer-level to panel-level processing aims to overcome limitations of traditional organic and silicon interposers. Simulation results indicate glass substrates offer significant improvements in warpage, thermal expansion, elastic modulus, power integrity, and
2026-06-16
www.moomoo.com
2026-06-16
Moomoo
__fail__